Visokoprecizne štampane ploče od vodećeg proizvođača

O kompaniji

Saifon Technologies od 2012. godine projektuje i proizvodi štampane ploče, pružajući kompletan ciklus usluga od razvoja do serijske proizvodnje po međunarodnim standardima.
Od 2020. godine takođe isporučujemo elektronske komponente i module za potrošačku i industrijsku elektroniku. Proizvodni pogoni su u Guangdžouu (Kina), a prodajni uredi u Nemačkoj, Kini, Meksiku i Rusiji.
12
godina
na tržištu (od 2012. godine)
12
meseci
garancija na štampane ploče
5 000+
partnera

Usluge

Dizajn i traganje za štampanim pločama
Od crteža do uređaja. Prototipizacija štampanih ploča
Štampane ploče
Isporuka elektronskih komponenti
Osnovni materijali
8D OTK

Tehničke mogućnosti

Factories capability
Board material (standart)
Board material (brends)
Serface
Maximum
Minimum
Tolerances
Solder mask
Silkscreen color
Technologies
Quality control
Factories capability
IMS
Fleksibilni
Standardni
HDI
Layers count
2
8
12
50
Board material (standart)
IMS
Fleksibilni
Standardni
HDI
FR-1
Y
FR-4
Y
Y
FR-4 HiTg [FR-5]
Y
Y
IMS. Aluminum base
Y
CEM-I
Y
CEM-III
Y
FCCL. Polyimide
Y
FCCL. PET
Y
HF CCL. PTFE
Y
Y
XPC
Y
Board material (brends)
IMS
Fleksibilni
Standardni
HDI
Arlon
Y
Y
Y
DuPont
Y
Y
Y
Isola
Y
Y
Y
ITEQ
Y
Y
Nelco
Y
Y
Panasonic
Y
Y
Rogers
Y
Y
Taconic
Y
Y
TUC
Y
Y
WANGLING
Y
Y
Serface
IMS
Fleksibilni
Standardni
HDI
Finish Coatings
— POS-63 (HASL)
— Lead-Free Soldering (HASL LF)
— Immersion Gold (ENIG)
— Immersion Gold (ENIG) / Silver / Tin
— POS-63 (HASL)
— Lead-Free Soldering (HASL LF)
— Immersion Gold (ENIG) / Silver / Tin
— Carbon Coating (CARBON)
— Organic Solderability Preservative (OSP)
— Gold Finger Plating
— Soft Gold (Ni ~ 2.5-6 µm / Au ~ 0.25-0.5 µm)
— Hard Gold (Ni ~ 2.5-6 µm / Au ~ 1.25 µm)
— Combined HASL+ENIG / CARBON+ENIG
— ENEPIG new!
— POS-63 (HASL)
— Lead-Free Soldering (HASL LF)
— Immersion Gold (ENIG) / Silver / Tin
— Graphite Coating (CARBON)
— Organic Coating (OSP)
— Gold Finger Plating
— Soft Gold (Ni ~ 2.5-6 µm / Au ~ 0.25-0.5 µm)
— Hard Gold (Ni ~ 2.5-6 µm / Au ~ 1.25 µm)
— Combined HASL+ENIG / CARBON+ENIG
— ENEPIG new!
Maximum
IMS
Fleksibilni
Standardni
HDI
Aspect ratio PTH
10:1
12:1
20:1
Copper thickness outer
3 oz
4 oz
2 oz
28 oz
Copper thickness inner
1 oz
6 oz
28 oz
Board thickness
3 mm
0,3 mm
10 mm
10 mm
Hole-wall copper
25 um
35 um
70 um
Board size for ≤ 2 layers
500x1200 mm
250x1500 mm
630х1200 mm
630х1200 mm
Board size for Multi-layers
250x450 mm
550х650 mm
610х1016 mm
Ø D closed by Geen SM
0,4 mm
0,4 mm
0,4 mm
0,4 mm
Minimum
IMS
Fleksibilni
Standardni
HDI
Ø Via Drill
0,15 mm
0,1 mm
0,1 mm
0,1 mm
Ø Via Laser
0,075 mm
Annular Ring
100 um
75 um
50 um
Board thickness
0,4 mm
0,08 mm
0,4 mm
0,1 mm
Solder mask bridge
0,1 mm
0,1 mm
0,1 mm
0,075 mm
Track width/space
0,15 / 0,15 mm
0,1 / 0,1 mm
0,1 / 0,1 mm
0,05 / 0,05 mm
Track & edge gap V-CUT
0,30 mm
0,30 mm
0,20 mm
Track & edge gap milling
0,20 mm
0,20 mm
0,15 mm
Tolerances
IMS
Fleksibilni
Standardni
HDI
Warpage
±0.75% (can be reduced to ±0.5% upon project approval)
±0.75% (can be reduced to ±0.5% upon project approval)
±0.75% (can be reduced to ±0.5% upon project approval)
±0.75% (can be reduced to ±0.5% upon project approval)
Track width
± 20%
± 20%
± 20%
± 10%
Outline
± 0,12 mm
± 0,2 mm
± 0,1 mm
± 0,075 mm
Board thickness
± 10%
± 0,05mm
± 10%
± 0,1mm / ±8%
Ø Via PTH
± 0,075 mm
± 0,08 mm
± 0,075 mm
Ø Via NPTH
±0,1 mm
±0,05 mm
±0,05 mm
±0,05 mm
Impedance
±10%
±5%
V-CUT line
± 10° / ± 0,4 mm
± 10° / ± 0,4 mm
± 5° / ± 0,2 mm
Milling
± 0,15 mm
± 0,15 mm
± 0,15 mm
-0,075 mm
Solder mask
IMS
Fleksibilni
Standardni
HDI
White
Y
Y
Y
Y
Super white
Y
Black
Y + matt
Y
Y + matt
Y + matt
Green
Y + matt
Y
Y + matt
Y + matt
Red
Y + matt
Y + matt
Blue
Y
Y
Yellow
Y
Y
Y
Other used colors
EMI; coverlay
Orange; purple
Peelable SM
Silkscreen color
IMS
Fleksibilni
Standardni
HDI
White
Y
Y
Y
Y
Black
Y
Y
Y
Y
Green
Y
Y
Y
Red
Y
Y
Blue
Y
Y
Yellow
Y
Y
Other used colors
Grey
Grey
Technologies
IMS
Fleksibilni
Standardni
HDI
3D metallization
Y
Y
Edge platting/gold platting
Y
Back-Drill Burred VIAs
Y
Blind & buried VIAs
Y
Y
Cross blind-buried VIAs
Y
Cross blind-buried VIAs
Y
Y
Y
Countersink/counterbore hole
Y
Y
Y
Half-cutted/Castellated hole
Y
Y
Y
Laser Micro VIAs
Y
Y
Press-fit hole
Y
Y
Plugged VIAs
Y
Y
Y
Y
Via-in-Pad Technology
Y
Asymmetric stack-up
Y
Y
Hybrid stack-up (FR-4 + Rogers)
Y
Y
Kapton tape
Y
Y
Y
LTCC
Y
Mirorred Alu
Y
Y
Multicolor tech
Y
Y
Peelable solder mask
Y
Y
Y
Silicone roll for Rigid-flex PCB
Y
Y
Jump-scoring
Y
Y
Y
Y
Z-Routing
Y
Y
Y
Y
Press fit coin technology
Y
Y
Quality control
IMS
Fleksibilni
Standardni
HDI
AOI for all inner layers
Y - 100%
Y - 100%
Y - 100%
Y - 100%
Cross section
Y
Y
Y
Y
E-test (Fixture or Flying Probe)
Y
Y
Y
Y
High POT testing
Y - if needed
Y - if needed
Y - if needed
Y - if needed
Impedance control ±10%
Y
Y
Y
Y
Impedance control down to ±5%
Y
Y - if needed
Y
Humidity paper indicator
Y - if needed
Y - if needed
Y
Y
IPC A-600H
class 2
class 2-3
class 2-3
class 3
Outgoing test-report and COC
Y
Y
Y
Y
With Test Coupon
Y - if needed
Y - if needed
Y - if needed
Y - if needed

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